Classroom-Seminar:
Thermal management in electronics

The ANSYS Icepak tools offer direct links from the simulation environment to the ECAD system describing the board and traces and smoothly build a numerical model to simulate cooling by conduction, free and forced convection as created by all kind of cooling techniques. The goal of the seminar is to cover how Icepak can be used to solve problems in electronic cooling.

• Graphic User Interface
• Icepak graphic user interface
• Introduction to objects
• Model Tree
• Menus and Model Appearance
• Advanced interface functionality

• Geometric and Physical modelling
• Object Shapes in Icepak
• Editing and alignment functions
• Objects that obstruct the flow
• Objects that permit or drive the flow
• Collections of objects
• Icepak complex objects
• Packages and Heat sinks
• Networks

• Meshing
• Meshing Priorities
• Mesh Controls parameters
• Mesh quality and diagnostics
• Non-conformal meshes
• Rules and limitations
• Nesting meshes

• Problem definition and Solving
• Problem definition
• Preparing to solve a model
• Running the solution
• Convergence
• Under-relaxation and multi-grid solver

• Parametric solution and Optimization
• Defining parameters
• Parametric runs
• Optimization

• Aspects of heat transfer and physical models
• Radiation
• Transients
• Buoyancy and natural convection
• Governing equations
• Turbulence models

• Post-processing and Reporting
• Graphical display
• Reports
• Creating Profiles
• Zoom-in Modelling

• MCAD and ECAD import and export
• MCAD import
• ECAD import
• Icepro

Electronic industry extensively uses ECAD systems for the development of packages, PCBs and even full systems. Power density and power dissipation are going up constantly and the complexity of the related geometry is increasing. In order to keep electrical functionality, a high quality thermal design is required and effective tools for the simulation of electronic cooling become indispensable.