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Aktuelle Webinare

Signal Integrity Webinar Series:
Bridging the Electro-Thermal Divide

Datum: Dienstag, 29. August 2017
Zeit: 17:00 (MEZ)


Beschreibung:

This webinar will discuss electro-thermal design solutions to problems resulting from increased power densities in electronic products. But in order for these solutions to actually work, Electrical and Mechanical Engineers need a better way to design and collaborate so that electronic products are robust and meet reliability specifications.

That's exactly what ANSYS HFSS provides. It now incorporates ANSYS Icepak within the Electronics Desktop, puts "Predictive Thermal Design" directly into the hands of Electrical Engineers and enables them to improve collaboration with Mechanical Engineers. ANSYS Icepak features highly accurate predictive simulation based on Computational Electromagnetics and Fluid Dynamics, and engineers can easily share models and results with each other. This collaborative approach truly provides a better way for engineers to solve electro-thermal problems of any model designed in Mechanical CAD (MCAD) or Electrical CAD (ECAD). Join us as we cover topics that go from "Chip to Product" and learn how ANSYS simulation software reliably predicts electro-thermal behavior over staggering scales of size that range from a 7nm silicon device to a 15m-long fighter jet.

 

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The Next Big Thing in Engineering Simulation

Datum: 07. September 2017
Zeit: 16:00 (MEZ)


Beschreibung
:

On September 7th at 10 a.m. EDT, we will unveil a new technology that will facilitate discoveries and breakthroughs, and take engineers' efforts to the next level. Product development will change, and simulation will be more accessible for every engineer. You don't want to miss this opportunity to catch the first glimpse of something entirely new from ANSYS. It just might be the next big thing in engineering simulation.

 

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ANSYS 18 Webinaraufzeichnungen

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